> Side Channel Analysis
Ready-to-use side channel tools to assess cryptography algorithms.
> Laser & EM Fault Injection
Make sure your chip withstands different techniques of physical fault injections.
> Firmware Security Analysis
Qualify embedded code binaries without physical devices and benches.
> Security Failure Analysis
Photoemission analysis to explore internal information in a chip.
> Vulnerability Research
Dynamic analyses at a system level for investigating potential vulnerabilities.
> Data Science Platform
esDynamic is a complete data focused platform to leverage the know-how of your team for complex analyses.
> esFirmware Engine
Assess the security of the firmware of IoT devices against logical and physical attacks.
> REVEN Engine
Record and replay vulnerability researches within reverse engineering processes and tools.
> Cybersecurity Training
Grow your expertise with training modules driven by a coach.
> Mobile App Security
Know the threats and risks of your Mobile App.
Integrate the security protections verification in your CI/CD pipeline.
> Automated Mobile App Security Testing
esChecker SaaS: automating the security testing of your mobile app binary.
> Mobile App Penetration Testing
Testing the resiliency of your Mobile App, SDK or RASP tool.
> Backend Penetration Testing
Testing the resiliency of your Web App, API or Backend Systems.
> Coaching for Mobile App Developers
Providing insights into the mobile app threats and how attackers work by a learning-by-doing approach.
Laser beams, Electromagnetic pulses or Electric glitches are typical ways to generate faults. Qualifying your hardware against such a threat requires a setup in line with the latest developments to anticipate new threats and mitigate risks.
To assess the resistance of your hardware against fault attacks, you need to:
The resulting solution allows the implementation of Laser Fault Injections at the state-of-the-art.
✅ Simple or double fault injection laser. The smallest and most powerful spot of the industry.
✅ Different laser sources, with a focus on near infrared for back-side.
✅ Back-side imaging with a unique system allowing chip and laser observation while pulsing.
✅ Get further with extra features, such as spot size parameter, tip tilt table, etc.
At eShard, we have developed our own technology to inject near field electromagnetic pulses. We designed probes to inject faults in modern devices, such as SoC (System on Chip) with recent technologies.
You are the experts and we empower you. eShard’s fault injection solution is designed to make sure you stay in control. Reconciling the know and the how into a unique know-how content.
Fault injection may turn out to be a powerful means to compromise a device. The ability to secure a system against fault injection depends on the ability to apprehend the technique. It requires practical expertise. Starter kits have been designed to provide the knowledge of practical attacks on recent use cases. They show the complexity of identifying a weakness. Starter kits provide a set of hardware and knowledge to create an in-house reference for practical attacks. For your internal knowledge and training purposes.
Getting up to speed in fault injection requires knowledge of the technique and practical experience. Together with ALPhANOV, a dedicated training was designed to cover all aspects of professional laser fault injections. Delivered on site in ALPhANOV’s training centre, this training will cover both the theoretical and practical aspects of a successful fault injection on a real device.
Our lab hosts all the state-of-the-art equipment to implement different physical techniques to perform fault injections: laser, near field electromagnetic or glitch. The laser and optical benches are provided by ALPhANOV as part of our close partnership in their secure premises. Regardless of the fault injection technologies, our expertise team can handle any kind of device. As a result of our expertise, it will be possible to get the evaluation material that you will be able to run in your own lab.
Recent projects included: